Interface optimization for improved routability in chip-package-board co-design

T. Meister, J. Lienig, Gisbert Thomke
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引用次数: 4

Abstract

The simultaneous optimization of both pin assignment and pin routing for different hierarchy levels (chip, package, board) of an electronic system is a bottleneck in today's hierarchical co-design flows, typically requiring manual optimization strategies and multiple iterations. Specifically, a fast and finegrained evaluation of routability that considers all requirements between the different hierarchy levels is missing. In this paper we provide a comprehensive, fast method to evaluate the routability of interfaces in hierarchical systems based on a new probabilistic routability prediction. We implemented our methodology in an industrial design flow and achieved significant improvement in overall routing, including reduced manufacturing costs of chip-package-board co-designs.
芯片封装板协同设计中改进可达性的接口优化
电子系统的不同层次(芯片、封装、电路板)的引脚分配和引脚路由同时优化是当今分层协同设计流程的瓶颈,通常需要人工优化策略和多次迭代。具体来说,缺少考虑不同层次结构级别之间所有需求的快速和细粒度的可达性评估。本文基于一种新的概率可达性预测,提出了一种全面、快速的分层系统中接口可达性评估方法。我们在工业设计流程中实施了我们的方法,并在总体路由方面取得了显着改进,包括降低了芯片封装板协同设计的制造成本。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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