Analysis on thermo-mechanical reliability of TSV interposer and solder joint

Abstract

TSV interpsoer is one of the common forms used the 3D package. In this paper, the 3D finite element method is used to analyze the thermo-mechanical reliability of TSV interposer and solder joint. This paper focuses on the influence of several points including IMC, TSV distribution, underfill, substrate and the structure of TSV. The finite element modeling results draw some cinclusion. Stress of both interposer and solder joint with the IMC is much larger than that without IMC. The effect of solder joint distribution is not significant to the reliability of interposer and solder joint. Underfill is beneficial to reliability of solder joint, but makes interposer stress large. The solder joint reliability is more sensitive to substrate thickness for package without underfill. It is validated by finite element analysis that the structure of unfully filled TSV is beneficial to reduce the mismatch between copper and silicon.