Decoration of particles by thin tantalum films

V. Pandit, W. Prater, N. Tran, P. Kothnur
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Abstract

Surface particle defects smaller than the minimum detection limit (MDL) of particle detection metrology, may, after a thin-film deposition step, get decorated and become larger than the MDL. Chip manufacturers may therefore incorrectly identify the thin-film deposition step as the defect creation step and allocate resources incorrectly. The effect of thin film deposition on pre-existing poly-styrene latex (PSL) spheres on the wafer surface was studied. Results show that both the physical size and scattering cross section of the spheres increased after thin film deposition. For a film thickness of 128 nm, the increase in size of the PSL spheres was found to be about 60–80 nm depending on original particle size. Experimental results are in good agreement with feature scale simulations. Shadowing at the interface of large PSL spheres and the wafer surface was predicted by simulations and confirmed by experimental observations.
用钽薄膜对颗粒进行装饰
小于颗粒检测计量的最小检测限(MDL)的表面颗粒缺陷,经过薄膜沉积步骤后,可能被修饰而大于最小检测限。因此,芯片制造商可能会错误地将薄膜沉积步骤识别为缺陷产生步骤,并错误地分配资源。研究了薄膜沉积对硅片表面已有聚苯乙烯乳胶球(PSL)的影响。结果表明:薄膜沉积后,微球的物理尺寸增大,散射截面增大;当膜厚为128 nm时,PSL球的尺寸增加约为60-80 nm,这取决于原始粒径。实验结果与特征尺度模拟结果吻合较好。通过模拟预测了大PSL球体与晶圆表面交界面的遮蔽现象,并通过实验观测证实了这一现象。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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