High density 3D fanout package for heterogeneous integration

Abstract

Three-dimensional (3D) fanout package stacking offers new levels of performance, high-density integration, and form factor advantages. Known-good fanout packages are stacked, and the vertical connection is built through Cu pillars in the molding area and solder bumps. Compared to existing TSV-based 3D integrated circuits (3DIC) technology, this solution reduces thermal crosstalk when integrating devices of different die sizes. Fanout package stacking potentially provides a cost-effective platform for highly flexible heterogeneous integration of digital, memory, analog, radio-frequency (RF) and optical devices.