Rectangle-packing-based module placement

H. Murata, K. Fujiyoshi, S. Nakatake, Y. Kajitani
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引用次数: 424

Abstract

The first and the most critical stage in VLSI layout design is the placement, the background of which is the rectangle packing problem: Given many rectangular modules of arbitrary site, place them without overlapping on a layer in the smallest bounding rectangle. Since the variety of the packing is infinite (two-dimensionally continuous) many, the key issue for successful optimization is in the introduction of a P-admissible solution space, which is a finite set of solutions at least one of which is optimal. This paper proposes such a solution space where each packing is represented by a pair of module name sequences. Searching this space by simulated annealing, hundreds of modules could be successfully packed as demonstrated. Combining a conventional wiring method, the biggest MCNC benchmark ami49 is challenged.
基于矩形包装的模块放置
VLSI版图设计的第一个也是最关键的阶段是布局,其背景是矩形布局问题:给定任意位置的许多矩形模块,将它们不重叠地放置在最小的边界矩形的一层上。由于填充的多样性是无限的(二维连续的)许多,成功优化的关键问题是引入p容许的解空间,它是一个有限的解集,其中至少有一个是最优的。本文提出了这样一个解空间,其中每个包装由一对模块名称序列表示。通过模拟退火对该空间进行搜索,可以成功封装数百个模块。结合传统的布线方法,最大的MCNC基准ami49受到挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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