Multiphysics Simulation for Silicon Carbide Power Module Design Optimization

Abstract

Electric-thermo-mechanical interaction has significant effect on the lifetime of a semiconductor power module. It is crucial to conduct collaborative simulations during the design phase to optimize the electrical and thermal performance of the power module and to minimize the thermomechanical stress from lifetime consideration. This study highlights the challenges of power module design in electronic, thermal, and mechanical co-simulation and presents a methodology in characterizing power module’s transient thermal response through transient CFD simulation and introduces a method of conducting mold flow analysis of power module by general CFD software. A concept for conducting multiphysics simulation is also proposed for power modules design using a single integrated general computer-aided engineering (CAE) software.