Transport and leakage in super-critical thickness strained silicon directly on insulator MOSFETs with strained Si thickness up to 135 nm

I. Åberg, Z. Cheng, T. Langdo, I. Lauer, Anthony Lochtefeld, D. Antoniadis, J. Hoyt
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引用次数: 2

Abstract

In this work, we study both FD- and PD-SSOI with aggressive T/sub Si/ of up to 135 nm for 14% SSOI (14% Ge equivalent strain). We have demonstrated that mobility in 14% SSOI is independent of the strained Si thickness, even for as grown films 10/spl times/ thicker than the critical thickness. Off-state current also remains independent of T/sub Si/. The successful fabrication of PD-SSOI with electron mobility enhancement maintained at 1.5/spl times/, for high channel doping and strained Si thickness up to 135 nm, was also demonstrated, showing promise for thicker film PD-SOI applications.
在这项工作中,我们研究了FD-和PD-SSOI,在14% SSOI (14% Ge等效应变)下,侵略性T/sub Si/高达135 nm。我们已经证明,14% SSOI中的迁移率与应变Si厚度无关,即使生长的薄膜比临界厚度厚10/spl /。断态电流也与T/sub Si/无关。在高通道掺杂和应变Si厚度高达135 nm的情况下,PD-SSOI的电子迁移率增强保持在1.5/spl倍/,这也证明了PD-SSOI在厚膜PD-SOI中的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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