The observation of BTI-induced RTN traps in inversion and accumulation modes on HfO2 high-k metal gate 28nm CMOS devices

P. Wu, E. Hsieh, P. Y. Lu, S. Chung, K. Chang, C. H. Liu, J. Ke, C. Yang, C. Tsai
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引用次数: 4

Abstract

A comprehensive analysis on the BTI induced RTN traps in high-k(HK) CMOS devices have been investigated in inversion (inv.) and accumulation (acc.) modes. The combination of two modes for RTN measurement provides a wide range of energy window in high-k gate dielectric, in which a simple extraction method of RTN analysis has been adopted to analyze the gate dielectric dual-layer of advanced HK devices. The results show that inversion mode measurement can only identify the RTN traps in the channel region, which is related to the Vth degradation. While, accumulation mode may detect the traps inside the gate-drain overlap region which provides better understanding of GIDL current. This basic understanding is of critical important to the quality development of HK gate dielectrics in advanced CMOS technologies.
在HfO2高k金属栅28nm CMOS器件上,bti诱导的RTN阱在反转和积累模式下的观察
对高k(HK) CMOS器件中BTI诱导的RTN陷阱进行了反演(inv)和积累(acc)模式的综合分析。结合两种模式进行RTN测量,在高k栅极介电介质中提供了宽范围的能量窗口,其中采用简单的RTN分析提取方法对先进HK器件的栅极介电双层进行了分析。结果表明,反演模式测量只能识别通道区域的RTN陷阱,这与Vth退化有关。而累积模式可以检测栅极-漏极重叠区域内的陷阱,从而更好地了解GIDL电流。这一基本认识对于先进CMOS技术中HK栅极电介质的高质量发展至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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