A Hardware and Thermal Analysis of DVFS in a Multi-core System with Hybrid WNoC Architecture

G. Harsha, H. Mondal, Sujay Deb
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引用次数: 8

Abstract

Evolution of CMOS manufacturing technologies has led to billions of transistors per chip, many core and System-on-Chip (SoC) realizations in current day systems. But maintaining this trend is a significant challenge due to the power and thermal issues. As the devices are scaled and number of transistors on the chip increases, the power density across the chip increases rapidly with each generation. This further results in increased system temperature that can cause damage to the system. Dynamic Voltage/Frequency Scaling (DVFS) schemes reduce the power consumption without significant loss in system performance. In this paper, we design and evaluate a centralized DVFS control mechanism for multi core systems and discuss its merits and overheads. One of the major issues with centralized controller implementation is the long delays associated with signal transmission between the controller and different clusters in the system. To alleviate this issue, we use wireless interfaces for transmitting controller signals along with the data signals. Towards this goal, we design a dual band transceiver & antenna for the wireless interfaces and present their implementation details. Finally the thermal profile of the proposed DVFS mechanism is analyzed and compared with normal operating conditions.
混合WNoC多核系统中DVFS的硬件和热分析
CMOS制造技术的发展已经导致每个芯片上数十亿个晶体管,许多核心和片上系统(SoC)在当今系统中实现。但由于电力和热问题,保持这一趋势是一项重大挑战。随着器件的规模和芯片上晶体管数量的增加,芯片上的功率密度随着每一代的增加而迅速增加。这进一步导致系统温度升高,从而对系统造成损坏。动态电压/频率缩放(DVFS)方案在不显著降低系统性能的情况下降低了功耗。在本文中,我们设计和评估了一种多核系统的集中式DVFS控制机制,并讨论了其优点和开销。集中式控制器实现的主要问题之一是控制器与系统中不同集群之间的信号传输相关的长延迟。为了解决这个问题,我们使用无线接口来传输控制器信号和数据信号。为此,我们设计了无线接口的双频收发器和天线,并给出了它们的实现细节。最后对所提出的DVFS机制的热分布进行了分析,并与正常工况进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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