{"title":"Finite element analysis of hygro-thermal induced failure in plastic packages","authors":"N. Sun, D. Lin, Daoguo Yang","doi":"10.1109/EPTC.2003.1298765","DOIUrl":null,"url":null,"abstract":"This paper focuses on ways to analysis the hygro-thermal induced failure mechanism with finite element simulations. The objective is how to evaluate the vapor pressure through the moisture concentration. To predict the position where the failure would happen, a modified Gurson's model is induced and is expanded to represent the contribution of the vapor pressure.","PeriodicalId":201404,"journal":{"name":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2003.1298765","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper focuses on ways to analysis the hygro-thermal induced failure mechanism with finite element simulations. The objective is how to evaluate the vapor pressure through the moisture concentration. To predict the position where the failure would happen, a modified Gurson's model is induced and is expanded to represent the contribution of the vapor pressure.