A Closer Look to Fan-out Panel Level Packaging

Abstract

Fan-out Wafer and Panel Level Packaging are two of the dominating trends in microelectronics packaging. Both approaches with different flavors as RDL last face-up or face-down have reached maturity and are introduced in high volume manufacturing. This paper discusses warpage in detail as one key challenge in fan-out packaging and how to influence the warpage during processing of a reconfigured panel for Chip first / RDL last approach.