Edge-defined 90nm TFTs with adjustable V/sub T/ in a 3-D compatible process

J. Nasrullah, J. Burr, G. Leonard Tyler, Y. Nishi
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Abstract

This work focuses on the processing technology that achieves device V/sub T/ adjustability in second and higher layers of short-channel stacked devices. The device mobility and adjusted subthreshold behavior reported here are, however, comparable to those in other TFT work.
边缘定义的90nm tft具有可调的V/sub / T/ 3d兼容工艺
本文主要研究在短通道堆叠器件的第二层及以上层实现器件V/sub / T/可调的加工技术。然而,这里报告的器件移动性和调整的阈下行为与其他TFT工作相当。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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