Super-multipoint thickness measurement technology using optical macro inspection system

Abstract

In this report, a new technology of entire wafer surface film thickness measurement is explained. The technology provides an extra-fine map of entire wafer surface using the data of about 440,000 measurement points. We show the benefit of having an extremely large number of measurement points for detecting local film thickness characteristics. This “super-multipoint thickness measurement technology” is based on the use of an optical macro inspection system, and it enables more precise film deposition tool management.