Non-Contact, In-Line Thermal Characterization Capability with Time Domain Thermoreflectance

Abstract

Thermal management is a critical aspect of integrated device design and manufacture. Time Domain Thermoreflectance (TDTR) is a powerful tool for the characterization of thermal transport in thin films and multi-layer stacks. In this paper, we present successful extension of in-line non-contact, non-destructive picosecond ultrasonic metrology for simultaneous measurements of layer thickness and thermal properties.