Ball Grid Array (BGA): The New Standard For High I/O Surface Mount Packages

Abstract

BALL GRID ARRAY (BGA) PACKAGE the package rather than as leads on the package periphery, the 1 5 mm pitch 225 BGA package occupies significantly less area on a PCB than the 0 5 mm 208 lead PQFP alternative Figure 3 shows the size advantage of BGAs over PQFPs for different lead pitches and pin counts This graph also highlights the point that a systems designer can take advantage of the area array interconnect of BGAs to achieve very high interconnect density at the motherboard level while still maintaining a relatively large soldering pitch which does not require new processes and equipment 1 0 Plr" 1 i I