Hybrid 3D pre-bonding test framework design

Abstract

We have proposed in this paper a hybrid wireless test framework for pre-bond testing of 3D-SICs. This framework exploits high data rate & low noise near field inductive coupling mechanism for test data transfer. Test stimuli for IP cores and test control for TSV BIST are wirelessly transmitted through the probe card. Test responses from IP cores and TSV BIST are relayed back to the probe card by WiPads. A scheduling heuristic was further proposed for parallel testing of TSVs and IP cores, achieving reasonably close testing times to LB.