A CMOS active pixel sensor for charged particle detection

H. Matis, F. Bieser, S. Kleinfelder, G. Rai, F. Retlere, Hans, G. Titter, K.S. Samuel, E. Wurzel, H. Wieman, E. Yamamoto
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引用次数: 13

Abstract

Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 /spl mu/m. Each array is divided into sub-arrays in which different sensor structures (4 in the first version and 16 in the second) and/or readout circuits are employed. Measurements of several of these structures under Fe/sup 55/ exposure are reported. The sensors have also been irradiated by 55 MeV protons to test for radiation damage. The radiation increased the noise and reduced the signal. The noise can be explained by shot noise from the increased leakage current and the reduction in signal is due to charge being trapped in the epi layer. Nevertheless, the radiation effect is small for the expected exposures at RHIC and RHIC II. Finally, we describe our concept for mechanically supporting a thin silicon wafer in an actual detector.
一种用于带电粒子检测的CMOS有源像素传感器
主动像素传感器(APS)技术为下一代顶点检测器提供了前景。本文讨论了两代APS芯片的设计与测试。两者都是128 × 128像素的数组,每个20 × 20 /spl mu/m。每个阵列被分成子阵列,其中使用不同的传感器结构(第一个版本中有4个,第二个版本中有16个)和/或读出电路。本文报道了这些结构在Fe/sup 55/下的测量结果。这些传感器还被55兆电子伏的质子照射,以测试辐射损伤。辐射增加了噪音,减弱了信号。噪声可以用泄漏电流增加产生的散粒噪声来解释,信号的减少是由于电荷被困在外延层中。然而,对于RHIC和RHIC II的预期暴露,辐射效应很小。最后,我们描述了在实际探测器中机械支撑薄硅晶片的概念。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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