Parallel thermal analysis of hybrid and SMT modules using 2D and 3D models

Abstract

Describes the results of parallel thermal analysis of hybrid and SMT modules. 2D thermal model is presented in brief Theoretical analysis, modelling and simulation of temperature distribution were done for the realized hybrid module (containing thick film and chip components). Simulations of temperature distribution in the realized hybrid module were done taking into account the larger thermal power sources. The experimental part (3D model) is based on thermal measurements of the realized hybrid and SMT modules, using a matrix of flip-chip sensors. Thermal measurements were done at different ambient temperatures and different hybrid and SMT module power values. The obtained simulation and experimental results for the hybrid module are graphically presented. Also, experimental results obtained for the SMT and hybrid module at different ambient temperatures and power loads were compared and analyzed.