Quasi-breakdown in ultra-thin oxides: some insights on the physical mechanisms

S. Bruyère, D. Roy, E. Vincent, G. Ghibaudo
{"title":"Quasi-breakdown in ultra-thin oxides: some insights on the physical mechanisms","authors":"S. Bruyère, D. Roy, E. Vincent, G. Ghibaudo","doi":"10.1109/IRWS.2000.911898","DOIUrl":null,"url":null,"abstract":"This paper discusses the variation of the probability to observe quasi-breakdown with capacitor topology and stress conditions and gets some insights on the physical mechanisms of both breakdown and quasi-breakdown phenomena. To achieve this goal, a methodology based on competing mechanisms between breakdown and quasi-breakdown is introduced in order to rigorously analyze Time Dependent Dielectric Quasi-breakdown. This approach is found to provide specific and distinct parameters for breakdown and quasi-breakdown, such as Weibull slope, acceleration factor and activation energy, which enable to well model the quasi-breakdown rate behavior with the capacitor topology and the stress conditions. This good adequation first validate this methodology and undoubtedly indicates that the physical defects at the origin of both phenomena are different. Additionally, the quasi-breakdown is demonstrated to occur on a reduced window of carrier energy, what confirms the distinct origins of both phenomena. Moreover, this induces some important consequences concerning reliability extrapolation, since the critical failure mode can be different at high field than at nominal condition.","PeriodicalId":374889,"journal":{"name":"2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515)","volume":"140 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.2000.911898","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

This paper discusses the variation of the probability to observe quasi-breakdown with capacitor topology and stress conditions and gets some insights on the physical mechanisms of both breakdown and quasi-breakdown phenomena. To achieve this goal, a methodology based on competing mechanisms between breakdown and quasi-breakdown is introduced in order to rigorously analyze Time Dependent Dielectric Quasi-breakdown. This approach is found to provide specific and distinct parameters for breakdown and quasi-breakdown, such as Weibull slope, acceleration factor and activation energy, which enable to well model the quasi-breakdown rate behavior with the capacitor topology and the stress conditions. This good adequation first validate this methodology and undoubtedly indicates that the physical defects at the origin of both phenomena are different. Additionally, the quasi-breakdown is demonstrated to occur on a reduced window of carrier energy, what confirms the distinct origins of both phenomena. Moreover, this induces some important consequences concerning reliability extrapolation, since the critical failure mode can be different at high field than at nominal condition.
超薄氧化物的准击穿:关于物理机制的一些见解
本文讨论了准击穿发生概率随电容器拓扑结构和应力条件的变化,并对击穿和准击穿现象的物理机制有了一些认识。为了实现这一目标,引入了一种基于击穿和准击穿竞争机制的方法,以严格分析时间相关介质的准击穿。该方法为击穿和准击穿提供了特定的、不同的参数,如威布尔斜率、加速度因子和活化能,能够很好地模拟电容器拓扑结构和应力条件下的准击穿率行为。这种良好的充分首先验证了这种方法,并且毫无疑问地表明,这两种现象起源处的物理缺陷是不同的。此外,准击穿被证明发生在载流子能量的减少窗口上,这证实了这两种现象的不同起源。此外,由于临界失效模式在高场条件下可能与标称条件下不同,这引起了一些关于可靠性外推的重要后果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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