{"title":"A 120–166 GHz InP HBT Frequency Doubler with Conversion Gain of 4.4 dB","authors":"Q. Yu, Limin Sun, Weihua Yu, Bowu Wang, Ming Zhou","doi":"10.1109/IMWS-AMP53428.2021.9643995","DOIUrl":null,"url":null,"abstract":"This letter presents a 120-166GHz active frequency doubler in a $0.5-\\mu \\mathrm{m}$ InP heterojunction bipolar transistor (HBT) technology ($\\mathrm{f}_{\\mathrm{T}}/\\mathrm{f}_{\\max}=350$ GHz /532 GHz) with a 3-metal layer, thin-film microstrip wiring environment. A single-ended topology is employed to realize a fully integrated wideband frequency doubler. The doubler core uses common-emitter transistors. The simulated results show that the proposed doubler achieves a peak conversion gain of 4.4 dB at 150 GHz with 46-GHz 3-dB gain bandwidth, a typical fundamental rejection of 27 dB, the maximum output power of −0.6 dBm and a peak power efficiency of 2.1% when dc power is 41.2mW.","PeriodicalId":143802,"journal":{"name":"2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMWS-AMP53428.2021.9643995","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This letter presents a 120-166GHz active frequency doubler in a $0.5-\mu \mathrm{m}$ InP heterojunction bipolar transistor (HBT) technology ($\mathrm{f}_{\mathrm{T}}/\mathrm{f}_{\max}=350$ GHz /532 GHz) with a 3-metal layer, thin-film microstrip wiring environment. A single-ended topology is employed to realize a fully integrated wideband frequency doubler. The doubler core uses common-emitter transistors. The simulated results show that the proposed doubler achieves a peak conversion gain of 4.4 dB at 150 GHz with 46-GHz 3-dB gain bandwidth, a typical fundamental rejection of 27 dB, the maximum output power of −0.6 dBm and a peak power efficiency of 2.1% when dc power is 41.2mW.
本文介绍了一种120-166GHz有源倍频器,采用$0.5-\mu \mathrm{m}$ InP异质结双极晶体管(HBT)技术($\mathrm{f}_{\mathrm{T}}/\mathrm{f}_{\max}=350$ GHz /532 GHz),采用3金属层薄膜微带布线环境。采用单端拓扑结构实现全集成宽带倍频器。倍频核心采用共发射极晶体管。仿真结果表明,该倍频器在150 GHz时的峰值转换增益为4.4 dB,增益带宽为46 GHz,典型基波抑制为27 dB,最大输出功率为- 0.6 dBm,峰值功率效率为2.1% when dc power is 41.2mW.