Architecting large-scale SRAM arrays with monolithic 3D integration

J. Kong, Young-Ho Gong, S. Chung
{"title":"Architecting large-scale SRAM arrays with monolithic 3D integration","authors":"J. Kong, Young-Ho Gong, S. Chung","doi":"10.1109/ISLPED.2017.8009157","DOIUrl":null,"url":null,"abstract":"In this paper, we architect large-scale SRAM arrays with monolithic 3D (M3D) integration technology. We introduce M3D-based SRAM arrays with three different ways of integration: M3D-R (vertical routing-only), M3D-VBL (vertical bitline), and M3D-VWL (vertical wordline). We also apply M3D-based SRAM arrays to last-level caches: tag arrays for eDRAM LLCs and data arrays for SRAM LLCs. The proposed LLCs with M3D-based SRAM arrays lead to better performance and lower energy by 0.02%∼1.7% and 49.1%∼79.1%, respectively, compared to that with TSV-based 3D SRAM arrays.","PeriodicalId":385714,"journal":{"name":"2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2017-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISLPED.2017.8009157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16

Abstract

In this paper, we architect large-scale SRAM arrays with monolithic 3D (M3D) integration technology. We introduce M3D-based SRAM arrays with three different ways of integration: M3D-R (vertical routing-only), M3D-VBL (vertical bitline), and M3D-VWL (vertical wordline). We also apply M3D-based SRAM arrays to last-level caches: tag arrays for eDRAM LLCs and data arrays for SRAM LLCs. The proposed LLCs with M3D-based SRAM arrays lead to better performance and lower energy by 0.02%∼1.7% and 49.1%∼79.1%, respectively, compared to that with TSV-based 3D SRAM arrays.
构建具有单片3D集成的大规模SRAM阵列
本文采用单片3D (monolithic 3D, M3D)集成技术构建大规模SRAM阵列。我们介绍了基于m3d的SRAM阵列,具有三种不同的集成方式:M3D-R(垂直路由),M3D-VBL(垂直位线)和M3D-VWL(垂直字线)。我们还将基于m3d的SRAM阵列应用于最后一级缓存:eDRAM llc的标签阵列和SRAM llc的数据阵列。与基于tsv的3D SRAM阵列相比,基于m3d的SRAM阵列的LLCs性能更好,能量降低了0.02% ~ 1.7%和49.1% ~ 79.1%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信