A Hybrid Ring/Mesh Interconnect for Network-on-Chip Using Hierarchical Rings for Global Routing

S. Bourduas, Z. Zilic
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引用次数: 103

Abstract

A popular network topology for network-on-chip (NoC) implementations is the two-dimensional mesh. A disadvantage of the mesh topology is in its large communication radius. By partitioning a two-dimensional mesh into several sub-meshes and connecting them using a global interconnect, we can reduce the average number of hops for global traffic. This paper presents a hybrid architecture that partitions a large 2D-mesh into several smaller sub-meshes which are globally connected using a hierarchical ring interconnect. Hierarchical rings have been selected for study because of their simplicity, speed and efficiency in embedding onto a circuit layout, as well as for their suitability for efficient cache coherent protocols. An original SystemC modeling platform was implemented in order to compare the traditional 2D-mesh with the hybrid ring architectures and the simulation results will show that our hybrid architecture does indeed have a positive effect on the average hop count
采用分层环进行全局路由的片上网络混合环/网状互连
对于片上网络(NoC)实现来说,一个流行的网络拓扑是二维网格。网状拓扑的缺点是通信半径大。通过将二维网格划分为若干个子网格,并使用全局互连将它们连接起来,我们可以减少全局流量的平均跳数。本文提出了一种混合结构,该结构将一个大的二维网格划分为几个较小的子网格,这些子网格使用分层环互连进行全局连接。选择分层环进行研究是因为它们在电路布局中嵌入的简单,速度和效率,以及它们适用于高效的缓存相干协议。为了比较传统的二维网格和混合环结构,实现了一个原始的SystemC建模平台,仿真结果表明,混合环结构确实对平均跳数有积极的影响
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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