High breakdown voltage In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As metamorphic HEMT using In/sub x/Ga/sub 1-x/P graded buffer

K. Yuan, K. Radhakrishnan
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引用次数: 1

Abstract

Metamorphic In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As HEMT grown on GaAs with In/sub x/Ga/sub 1-x/P (x=0.48/spl rarr/1) graded buffer layer is reported. In this design the In/sub 0.53/Ga/sub 0.47/As channel layer was grown on top of the InGaP graded buffer directly without an InAlAs buffer as in the conventional design. The device shows high breakdown voltage: the measured on-state and off-state breakdown voltage are 11 V and 23 V, respectively, at a gate current of 0.1 mA/mm. The impact ionization rate and its dependence on temperature is also measured and analyzed, and the possible mechanism of the high breakdown voltage achieved is discussed. The metamorphic HEMT shows promising performance for its potential in power applications.
高击穿电压In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As变质HEMT采用In/sub x/Ga/sub 1-x/P梯度缓冲
在GaAs上生长了变质In/sub 0.52/Al/sub 0.48/As/In/sub 0.53/Ga/sub 0.47/As HEMT,并形成In/sub x/Ga/sub 1-x/P (x=0.48/spl rarr/1)渐变缓冲层。在本设计中,In/sub 0.53/Ga/sub 0.47/As通道层直接生长在InGaP渐变缓冲器的顶部,而不像传统设计那样使用InAlAs缓冲器。器件显示出高击穿电压:在栅极电流为0.1 mA/mm时,测得导通击穿电压为11 V,关断击穿电压为23 V。测量和分析了冲击电离率及其对温度的依赖关系,并讨论了高击穿电压产生的可能机理。变质HEMT具有良好的性能和应用潜力。
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