High-temperature characterization of a PD SOI CMOS process with LDMOS and lateral bipolar structures

S. Adriaensen, V. Dessard, P. Delatte, J.R. Querol, D. Flandre, S. Richter
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引用次数: 3

Abstract

High-temperature characterization of a 0.8 /spl mu/m partially-depleted (PD) silicon-on-insulator (SOI) CMOS process is reported. The process is designed for mixed analog/digital/high-voltage applications. The measurements have been realized on n-MOSFETs, on lateral bipolar transistors and on LDMOS transistors and demonstrate the interest of the process under consideration.
具有LDMOS和侧双极结构的PD SOI CMOS工艺的高温表征
报道了0.8 /spl mu/m部分耗尽(PD)绝缘体上硅(SOI) CMOS工艺的高温特性。该工艺专为混合模拟/数字/高压应用而设计。测量已经在n- mosfet、侧双极晶体管和LDMOS晶体管上实现,并证明了所考虑的工艺的兴趣。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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