The use of digital image processing for IC reverse engineering

Raul Quijada, Arnau Raventos, F. Tarrés, R. Dura, Salvador Hidalgo
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引用次数: 20

Abstract

IC Reverse engineering is the process to analyze an integrated circuit to obtain information about its design, materials, logic circuitry, functionality, performance and other relevant features. The increasingly complexity of microchips using a greater number of layers and logic gates makes this process unaffordable when using traditional methods that rely on human inspection and analysis. Therefore, digital image processing is presented as a fruitful field for automation. In this paper a system for the circuitry extraction, analysis and presentation is described. It is divided in three blocks: 2D Image Tiling, Logic Gates Localization & Recognition and Microchip Navigator. The paper presents an overview of the complete system and is mainly based on the description of the image processing algorithms that are applied to the different blocks such as image stitching, customized Scale Invariant Feature Transform (SIFT) and logic gate localization & recognition.
利用数字图像处理进行IC逆向工程
IC逆向工程是分析集成电路以获得其设计、材料、逻辑电路、功能、性能和其他相关特征信息的过程。使用更多层数和逻辑门的微芯片越来越复杂,当使用依赖人工检查和分析的传统方法时,这一过程难以承受。因此,数字图像处理是一个富有成效的自动化领域。本文介绍了一种电路提取、分析和呈现系统。它分为三个模块:二维图像平铺,逻辑门定位与识别和微芯片导航。本文概述了整个系统,主要描述了应用于不同块的图像处理算法,如图像拼接、自定义尺度不变特征变换(SIFT)和逻辑门定位与识别。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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