Advancing foundry technology with scaling and innovations

Shien-Yang Wu, C. Y. Lin, S. Yang, J. Liaw, J. Cheng
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引用次数: 18

Abstract

Being the dedicated IC foundry, TSMC provides a complete portfolio of technologies covering leading-edge technology, specialty technology, and 3D IC system integration technology to fulfill customer product needs in various market segments. While the leading-edge CMOS technology continues to extend Moore's law as a driver for business growth, More-than-Moore specialty technology leverages the logic technology platform with value-added components to enable various functionalities for a wide range of applications. In this paper, the evolution of advanced CMOS technology is reviewed. Challenges in scaling transistor, SRAM and interconnect are discussed. Examples of specialty technology will also be illustrated.
推动铸造技术的规模化和创新
作为专业的集成电路代工厂,台积电提供完整的技术组合,涵盖前沿技术,专业技术和3D集成电路系统集成技术,以满足客户在各个细分市场的产品需求。虽然领先的CMOS技术继续扩展摩尔定律,作为业务增长的驱动力,但More-than-Moore专业技术利用逻辑技术平台和增值组件,为广泛的应用提供各种功能。本文综述了先进CMOS技术的发展历程。讨论了晶体管、SRAM和互连方面的挑战。专业技术的例子也将被说明。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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