Factors affecting the forming characteristics of powder DCEL device

Abstract

Copper coating is a process that converts an insulative ZnS phosphor powder conductive. Forming is a crucial fabrication step in DCEL technology. Further, forming is known to be the cause of aging in DCEL devices. It is well known that the temperature measured on a substrate surface of DCEL pixel during forming is 105/spl deg/C, and the purpose of forming is to create a highly resistive thin region of which the function is not completely clear. This paper reports how the conductivity of copper-coated DCEL phosphor powder changes with its temperature, how the temperature of the coating solution and gaseous environment affect the conductivity-temperature relationship, how the temperature measured on the substrate surface of a DCEL pixel during forming relates to the critical temperature of its copper coated phosphor. The function of the formed region and the method to eliminate the forming are also discussed.<>