Fracture behavior of 96.5Sn3.0Ag0.5Cu solder joint under mixed-mode tensile and shear loading conditions

Abstract

Solder joints are subjected to a complex combined loading condition of tensile and shear deformation. The fracture behavior of solder joints is different when it is subjected to pure-tensile, pure shear or varying combination of mixed-mode tension and shear loading combinations. The observed failure modes can vary from brittle intermetallic (IMC) layer failure to ductile bulk solder shear failure. Under mixed-mode loading, a complex combination of IMC and solder failure mechanism is observed. In this study, the fracture behavior of solder joint will be investigated to study effect of mode mixity and plastic constraint on the failure mechanism. The fracture failure mode and behavior were observed and discussed under a range of fracture load cases.