Atomistic simulation of gate-all-around GaSb/InAs nanowire TFETs using a fast full-band mode-space NEGF model

A. Afzalian, M. Passlack, Y. Yeo
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引用次数: 3

Abstract

Atomistic device simulations are presented to assess the potential of InAs/GaSb GAA NW n- and p-TFETs with diameter d of 5.45 nm. Using a recent breakthrough in atomistic modeling, more than 100× reduction in simulation time was achieved using a tight binding mode-space approach. This enabled full-band transport simulation for a device with ~100,000 atoms, employing an accurate sp3s*SO (10 orbitals/atom) tight binding basis. At IOFF of 10 pA/μm, an optimized n-TFET with a pocket region is predicted to have ION of 46 and 196 μA/μm at VDD of 0.3, and 0.5 V, respectively. This achieves a better energy-delay product than its MOSFET counterpart. Through careful design, similar performance can be achieved for p- and n- TFETs.
栅极全能GaSb/InAs纳米线tfet的快速全频带模式空间NEGF模型原子模拟
采用原子器件模拟的方法对直径为5.45 nm的InAs/GaSb GAA NW n-和p- tfet的潜力进行了评估。利用原子建模的最新突破,使用紧密绑定模式空间方法将仿真时间减少了100倍以上。利用精确的sp3s*SO(10个轨道/原子)紧密结合基础,实现了具有~100,000个原子的器件的全波段传输模拟。在IOFF为10 pA/μm时,在VDD为0.3和0.5 V时,优化后的带口袋区的n-TFET离子强度分别为46和196 μA/μm。这实现了比其MOSFET对应物更好的能量延迟产品。通过精心设计,p-和n- tfet可以达到相似的性能。
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