High-performance AlO-laminated TaO MIM capacitors for RF-IC applications: effects of the AlO layer on electrical characteristics

Abstract

The successful integration of a metal-insulator-metal (MIM) capacitor with an AlO/TaO/AlO stack is demonstrated. High capacitance density of more than 10 fF//spl mu/m/sup 2/ at 3.3 V and superior high-frequency characteristics are confirmed. The TDDB lifetime of the capacitor is strongly dependent on the electric field strength in the AlO layer, so the lifetime can be predicted by using the TDDB lifetime of a single-layer AlO capacitor. The capacitance voltage dependence of the AlO/TaO/AlO capacitor is dominated by the change in capacitance in the AlO layer. Thus, the voltage-linearity coefficients of single-layer AlO capacitors can be used to predict the coefficients of AlO/TaO/AlO capacitors.