Carbon nanotubes as interconnects: Emerging technology and potential reliability issues

Abstract

The use of carbon nanotubes (CNTs) to replace or complement Cu-based IC interconnects is under wide-spread investigation. CNTs have low resistivities and can be configured to have low capacitive coupling, and are also chemically stable so that diffusion barriers are not needed. They can also carry very high current densities without damage. Properties and processing of CNTs for IC interconnects are reviewed and emerging technologies and possible reliability issues are discussed.