Metal contacts to p-type GaN by electroless deposition

L. Lewis, D. Casey, J. Rohan, P. P. Maaskant
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Abstract

Initial results are presented on the electroless deposition of metal contacts to p-type gallium nitride (GaN). Deposition procedures were developed for the deposition of both nickel and tungsten-cobalt (W-Co) contacts onto p-type GaN. Attempts to deposit platinum on p-type GaN failed, despite the fact that electroless platinum deposition was successfully achieved on other substrate types. Nickel contacts were overlaid with gold and annealed in oxygen ambient to form ohmic contacts with specific contact resistivity values down to 2x10-2 &OHgr;cm2. Measurements at elevated temperatures up to 140 degrees C showed that the specific contact resistivity was almost independent of temperature. The tungsten-cobalt contacts showed rectifying behaviour even after annealing at 650 degrees C. This makes this contact type a possible candidate for Schottky contacts in high temperature applications.
化学沉积p型氮化镓的金属触点
给出了化学沉积p型氮化镓金属触点的初步结果。研究了在p型氮化镓上沉积镍和钨钴(W-Co)触点的方法。在p型氮化镓上沉积铂的尝试失败了,尽管在其他衬底上成功地实现了化学沉积铂。镍触点覆以金,并在氧环境中退火形成欧姆触点,其特定接触电阻率值降至2x10-2 &OHgr;cm2。在高达140摄氏度的高温下的测量表明,比接触电阻率几乎与温度无关。钨钴触点即使在650℃退火后也表现出整流行为,这使得这种触点类型成为高温应用中肖特基触点的可能候选者。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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