Multi-Chip Module (MCM-D) using thin film technology

C. B. Adamo, A. Flacker, Wilson J. Freitas, R. C. Teixeira, Michele O. da Silva, A. Rotondaro
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引用次数: 6

Abstract

This work presents results of the Multi-Chip Module-Deposited technology built with thin film processes over a substrate of alumina and oxidized silicon that was used to micro-fabricate passive components (capacitors, resistors, inductors). Metal layers were deposited by sputtering, electrolytic and electroless techniques and benzocyclobutene was used as dielectric. Electrical characteristics of passive components and filters were evaluated indicating that the testchip and processes were effective to manufacture the devices.
多芯片模块(MCM-D)采用薄膜技术
这项工作展示了多芯片模块沉积技术的成果,该技术采用氧化铝和氧化硅衬底上的薄膜工艺,用于微型制造无源元件(电容器,电阻,电感器)。以苯并环丁烯为介质,采用溅射、电解和化学镀技术制备了金属层。对无源元件和滤波器的电气特性进行了评估,表明测试芯片和工艺对于制造器件是有效的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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