New approach for chipless and low cost identification tag in the THz frequency domain

Abstract

In the present paper, we present a new approach for data encoding in the THz frequency domain. We proposed a structure based on a 1D periodic stack of dielectric layers whose thickness is of the order of the wavelength, i.e. in the millimeter range. Such a device exhibits well known forbidden band gap (FBG) behavior when illuminated by an electromagnetic wave. We suggest modifying the periodicity of the stack to create defect levels in the 1st FBG to encode binary information. The layers are made of low cost dielectric materials such as pure low density polyethylene (LDPE) and a mixture of LDPE with mineral charges like CaCO3 or TiO2 as respectively low (L) and high (H) refractive index material. We show that such a device can be used for binary data encoding in the frequency range from 150 to 600 GHz with encoding capacities greater than 10 bits.