Development of a Low EMI Micro-controller Package for Automobile Applications

Y. Mabuchi, A. Nakamura, A. Ohmae, T. Uno, K. Ichikawa, H. Mizuno
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引用次数: 5

Abstract

For ECUs the common-mode current is the main cause of EMI problems. In this paper, the mechanism of common-mode current generation and an effective way to reduce it is considered theoretically. From the consideration it is obtained that the common-mode current caused by the differential-mode current can be suppressed by means of adjusting the impedance of a PCB to be balancing adequately. And a package in which the impedance adjusting circuit and oscillator circuit is implement is developed for a micro-controller. The measurement shows that the developed package can reduce the common-mode current generation compared to the conventional QFP package. And the developed package can minimize the value of the common-mode current by means of adjusting the inductance of the power bus line in the package.
汽车用低电磁干扰微控制器的研制
对于ecu来说,共模电流是产生电磁干扰的主要原因。本文从理论上探讨了共模电流产生的机理和减小共模电流产生的有效途径。通过对PCB的阻抗进行适当的调整,使其达到充分的平衡,可以抑制差模电流引起的共模电流。并为单片机设计了阻抗调节电路和振荡器电路的封装。测量结果表明,与传统的QFP封装相比,所开发的封装可以减少共模电流的产生。该封装可以通过调整封装内电源母线的电感来减小共模电流的值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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