Creep behavior characterization of some new materials for high density interconnect substrates using dynamic mechanical analyzer (DMA)

Abstract

Low-cost, high density interconnects (HDI) printed wiring board (PWB) is a critical technology for the next generation of high performance microelectronics. The precise characterization of the dielectr material used in the PWB and the solder mask, in particular, has significant effects on the HDI fabrication and reliability. For example, the design and reliability modeling of the HDI substrate depend crucially on the deformation rate and stress-strain relationship of these materials under specific thermal cyclic loading conditions. Dynamic mechanical analyzer (DMA) is a powerful instrument in measuring the viscoelasticity of materials in bending, compression, tension and shear. Using the TMA CONTROL FORCE testing mode of DMA, the creep behavior of some new dielectric and solder mask materials has been investigated and analyzed under different stress and temperature conditions. The results of this study provide critical parameters for the modeling of HDI substrate.