Challenges in epitaxial growth by RP-CVD of strained and relaxed GeSn epilayers on a Si substrate

D. Patchett, M. Myronov, S. Rhead, J. Halpin, D. Leadley
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Abstract

High Sn fraction GeSn has been grown by RP-CVD with SnCl4. However, challenges remain in creating device quality material suitable for subsequent growth. Surface segregation of tin, which increases with increased tin fraction, raises doubts about the suitability of GeSn as a platform for subsequent growth. Surface segregation may contribute to difficulties of achieving high growth rates and the growth of alloys with an increased tin fraction. The variability of tin content with depth necessitates the use of specialized compositional characterization such as SIMS. Growth of fully relaxed GeSn epilayers remains elusive, with many grown layers are partially relaxed. However, full relaxation is necessary for a direct bandgap material.
用RP-CVD在Si衬底上外延生长应变和松弛GeSn薄膜的挑战
以SnCl4为原料,采用RP-CVD法制备了高Sn分数的GeSn。然而,在创造适合后续增长的器件质量材料方面仍然存在挑战。锡的表面偏析随着锡分数的增加而增加,这引起了对GeSn作为后续生长平台的适用性的怀疑。表面偏析可能导致难以获得高生长速率和锡含量增加的合金生长。锡含量随深度的变化需要使用专门的成分表征,如SIMS。完全松弛的GeSn脱毛层的生长仍然是难以捉摸的,许多生长层是部分松弛的。然而,对于直接带隙材料,完全弛豫是必要的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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