Electrode and substrate contacts in carbon nanofiber interconnects

Abstract

To study the reliability of carbon nanofiber (CNF) interconnect under high-current stress, electrical and thermal transports across CNF-electrode interfaces and between electrodes are considered. For this investigation, three different types of contacts are examined: (a) CNF-Au electrode, (b) CNF-SiO2 substrate, and (c) tungsten-deposited CNF-Au electrode. We have determined that contact (c) improves the overall electrical and thermal transport characteristics of the system.