A novel substrate-assisted RESURF technology for small curvature radius junction

M. Qiao, Xi Hu, Heng-juan Wen, Meng Wang, Bo Luo, X. Luo, Zhuo Wang, Bo Zhang, Zhaoji Li
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引用次数: 26

Abstract

A novel substrate-assisted (SA) RESURF technology aiming at improving off-state breakdown voltage (BV) of PN junction with small curvature radius is proposed and experimentally demonstrated in this paper. The SA RESURF technology not only realizes small curvature radius in the fingertip region, but also reduces electric field concentration in the curved metallurgical junction. Low-doped P-substrate, which increases depletion of the small curvature radius junction and reduces electric field concentration in the curved metallurgical junction, is adopted in the source fingertip region. Owing to the existence of low-doped P-substrate, the abrupt PN junction with small curvature radius is adjusted to low-doped PN junction with large curvature radius. The SA RESURF technology can be widely applied to lateral high voltage devices with small curved junction, especially to lateral super junction devices. A CBSLOP-LDMOS with the proposed SA RESURF technology has been developed. The experimental results show that the CBSLOP-LDMOS exhibits off-state BV of 700 V and specific on-resistance (Ron, sp) of 142 mΩ·cm2.
一种用于小曲率半径结的新型基板辅助RESURF技术
提出了一种提高小曲率半径PN结脱态击穿电压(BV)的新型衬底辅助(SA) RESURF技术,并进行了实验验证。SA RESURF技术不仅实现了指尖区域曲率半径小,而且降低了弯曲冶金结处的电场浓度。在源指端区域采用低掺杂p衬底,增加了小曲率半径结的损耗,降低了弯曲冶金结的电场浓度。由于低掺杂p衬底的存在,小曲率半径的突变PN结被调整为大曲率半径的低掺杂PN结。该技术可广泛应用于弯曲结小的横向高压器件,特别是横向超结器件。开发了一种采用SA RESURF技术的cbslope - ldmos。实验结果表明,CBSLOP-LDMOS的off-state BV为700 V,比导通电阻(Ron, sp)为142 mΩ·cm2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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