Electrical modeling of the chip scale BGA

M. Caggiano, R. Brush, J. Kleban, P. J. Chuaypradit
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引用次数: 8

Abstract

The CSBGA package-modeling program can rapidly generate a model from a specific description of a package or from partial information when only a rough approximation is needed. This innovative new software is targeted for the engineer who, at his desktop PC or workstation, can rapidly generate an accurate electrical model of a chip scale BGA. Program operation consists of entering the available data, and retrieving output that can be used in a simulation, or simply analyzed for an idea as to the range of values the parasitic effects take. The whole process will just take minutes. The program was designed to be fast and portable contrasting other methods of modeling in which such attributes were sacrificed for greater accuracy. Such accuracy may not be desired in most applications where there is a greater emphasis on speed or where powerful workstations are not available. The models targeted for both data processing and RF systems will have a wide range of use across military and commercial electronics applications.
芯片级BGA的电学建模
CSBGA包建模程序可以根据包的特定描述或仅需要粗略近似时的部分信息快速生成模型。这种创新的新软件是针对工程师谁,在他的台式电脑或工作站,可以迅速产生一个芯片规模的BGA的准确的电模型。程序操作包括输入可用数据和检索可用于模拟的输出,或者简单地分析寄生效应所取值的范围。整个过程只需要几分钟。该程序被设计为快速和可移植的,与其他建模方法相比,这些建模方法牺牲了这些属性以获得更高的准确性。在大多数强调速度或没有功能强大的工作站的应用程序中,可能不需要这样的准确性。针对数据处理和射频系统的模型将在军事和商业电子应用中具有广泛的用途。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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