P. Gunupudi, R. Khazaka, A. Dounavis, M. Nakhla, R. Achar
{"title":"Global multi-level reduction technique for nonlinear simulation of high-speed interconnect circuits","authors":"P. Gunupudi, R. Khazaka, A. Dounavis, M. Nakhla, R. Achar","doi":"10.1109/EPEP.2001.967659","DOIUrl":null,"url":null,"abstract":"Presents two approaches for simulation of large interconnect networks with linear/nonlinear terminations. The first approach is suitable in forming macromodels of interconnect networks in order to use them repeatedly in different configurations. The second approach is a nonlinear time-domain circuit reduction technique that reduces the whole interconnect network including the nonlinear/linear terminations. This method is independent of the number of ports in the system.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967659","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Presents two approaches for simulation of large interconnect networks with linear/nonlinear terminations. The first approach is suitable in forming macromodels of interconnect networks in order to use them repeatedly in different configurations. The second approach is a nonlinear time-domain circuit reduction technique that reduces the whole interconnect network including the nonlinear/linear terminations. This method is independent of the number of ports in the system.