Vertical III-V nanowire MOSFETs, TFETs, and CMOS-Gates on Si: Processing in 3D

L. Wernersson
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引用次数: 0

Abstract

III-V MOSFETs are candidates for extension of the scaling roadmap beyond 10 nm. In the vertical direction, the requirements on gate-length scaling is less stringent and vertical III-V nanowire FETs are thus attractive for high density and low-power applications. While growth in the vertical direction allows flexibility in heterostructure combination and eases the path for integration on Si substrates, the processing in the vertical direction is still regarded challenging. Processing on the length scale of a few tens of nanometers has nevertheless been demonstrated including processing of vertical nanowire transistors with a diameter of 10 nm. Besides logic applications, III-V MOSFETs hold promises in the area of millimeter-wave electronics.
垂直III-V纳米线mosfet, tfet和cmos栅极在Si:三维加工
III-V型mosfet是扩展到10nm以上的扩展路线图的候选产品。在垂直方向上,对栅极长度缩放的要求不那么严格,因此垂直III-V纳米线场效应管对于高密度和低功耗应用具有吸引力。虽然垂直方向的生长允许异质结构组合的灵活性,并简化了在Si衬底上集成的路径,但垂直方向的加工仍然被认为是具有挑战性的。然而,在几十纳米的长度尺度上的加工已经被证明,包括直径为10纳米的垂直纳米线晶体管的加工。除了逻辑应用之外,III-V型mosfet在毫米波电子学领域也很有前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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