A combinatorial device analysis method of oxide thin-film transistors

S. Jeon
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Abstract

Defects at the interface as well as in the bulk of semiconductor of oxide thin film transistor are the major concern for the successful development of oxide thin-film devices since it governs initial transistor performance and reliability characteristics such as hysteresis and stress induced Vth shift. Once the oxide semiconductor is integrated in the device structures, the quality of oxide semiconductor and surrounding media could only be characterized by seeming information such as drive current, mobility, sub-threshold slope and hysteresis. Here we present a combinatorial device analysis method using pulsed I-V, transient I-V and low frequency noise measurement methods to assess the quality of oxide device. In this presentation, we will deal with various oxide thin-film transistors such as HfInZnO (HIZO) device with metal cation contents, HIZO-IZO bi-layer device and HIZO device with gate insulator quality. Via pulsed I-V measurement method, we found that conventional DC measurement method significantly underestimate the performance of oxide devices. Using a short pulse I-V analysis, the trapping time constants were identified. The charge trapping phenomena were verified by low frequency noise measurements. This combinatorial method can be an effective way to improve reliability characteristics of oxide devices as it provides an accurate and quantitative way to assess the quality of device.
氧化薄膜晶体管组合器件分析方法
氧化薄膜晶体管的界面缺陷和大部分半导体中的缺陷是氧化薄膜器件成功开发的主要问题,因为它控制着晶体管的初始性能和可靠性特性,如滞后和应力诱导的v值移位。一旦氧化物半导体集成到器件结构中,氧化物半导体和周围介质的质量就只能通过驱动电流、迁移率、亚阈值斜率和滞后等表面信息来表征。本文提出了一种组合器件分析方法,利用脉冲I-V、瞬态I-V和低频噪声测量方法来评估氧化器件的质量。在本报告中,我们将讨论各种氧化物薄膜晶体管,如含有金属阳离子的HfInZnO (HIZO)器件,HIZO- izo双层器件和具有栅极绝缘体质量的HIZO器件。通过脉冲I-V测量方法,我们发现传统的直流测量方法明显低估了氧化物器件的性能。利用短脉冲I-V分析,确定了捕获时间常数。通过低频噪声测量验证了电荷捕获现象。该组合方法为评价氧化器件的质量提供了一种准确、定量的方法,是提高氧化器件可靠性的有效途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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