Analog/RF performance of sub-100 nm SOI MOSFETs with non-classical gate-source/drain underlap channel design

A. Kranti, Rashmi, S. Burignat, J. Raskin, G. A. Armstrong
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引用次数: 17

Abstract

In this work, we analyze the potential of non-overlap (also known as underlap) source/drain (S/D) channel architecture to improve analog/RF performance metrics of sub-100 nm Ultra Thin Body BOX (UTBB) SOI MOSFETs. It is shown that underlap S/D design results in higher voltage gain (AVO) and cut-off frequency (fT) along with a broader analog ‘sweet spot’ in nanoscale MOSFETs thus offering new possibilities for analog/RF scaling below 60 nm. The advantages offered by underlap channel design are not limited to lower current levels (∼ 10 µA/µm) but extend up to 100 µA/µm which corresponds to optimum AVO and fT performance for most circuit applications. For shorter gate length devices, underlap design results in an impressive 20% improvement in fT along with a 2 fold enhancement in AVO. This work provides new opportunities for realizing future low-power analog/RF design with underlap UTBB MOSFETs.
采用非经典栅极-源极-漏极下迭通道设计的亚100nm SOI mosfet模拟/射频性能
在这项工作中,我们分析了非重叠(也称为underlap)源/漏极(S/D)通道架构的潜力,以改善sub-100 nm超薄体盒(UTBB) SOI mosfet的模拟/RF性能指标。研究表明,覆盖S/D设计可获得更高的电压增益(AVO)和截止频率(fT),以及纳米级mosfet中更宽的模拟“甜蜜点”,从而为60 nm以下的模拟/RF缩放提供了新的可能性。覆盖通道设计提供的优势不仅限于较低的电流水平(~ 10 μ A/ μ m),而且扩展到高达100 μ A/ μ m,这对应于大多数电路应用的最佳AVO和fT性能。对于较短栅极长度的器件,覆盖设计可使fT提高20%,AVO提高2倍。这项工作为实现未来低功耗模拟/RF设计提供了新的机会。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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