Advanced Packaging Using Chiplets and Standardized Physical Interfaces

Abstract

Electronic control units (ECU) for automotive and robotics are seen as one emerging technology driver for the chiplet technology. Such a system consists of several building blocks with dedicated functionality. Based on this wide range of functionalities, such a system is especially appropriate for an optimized chiplet based system. Blocks will be implemented in dedicated technologies, like advanced FinFet nodes for computing power, RF nodes for radio-frequency parts and special technologies like GaN for power requirements. To establish a proper interaction between chiplets from different technologies and from different vendors, standardized interfaces are required. This paper will present an implementation of Bunch-of-Wires (BoW) interface in an advanced FinFet node. Together with a former development in a RF-node, both chiplets will be integrated in an advanced package to demonstrate interoperable communication.