Vertical interconnection for flip chip connection

Abstract

In this paper we present computer simulations for vertical interconnections between a CPW transmission line and a CPW chip (CPW-CPW) using isotropic (ICA) and anisotropic (ACA) conductive adhesives. The location of the bumps in both types of adhesives is investigated for both interconnection types. Another structure is CPW-MS transition in which the active surface is turned upwards from the CPW board. The design of the circuit in this case is greatly facilitated - this configuration only needs one via-hole for each connection.