Performance Evaluation of On-chip Interconnect System using Prospective Neural Network Design

Ajita Misra, Diksha Diksha, Yash Agrawal, Vinay S. Palaparthy
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引用次数: 1

Abstract

Due to technology scaling in deep submicron region, on-chip interconnects have become a major concerning issue for overall circuit performance. Therefore, it is necessary to evaluate the performance of interconnects in order to predict the output of design. In this paper, back-propagation feed forward neural network (FFNN) technique is employed for performance prediction of driver-interconnect-load (DIL) model. Levenberg-Marquardt (LM) algorithm is used as the training algorithm. The neural network model provides faster prediction when compared to the traditional performance analysis method. Also the proposed method works closely with the simulation methods thereby depicting the accuracy of the developed model. The dataset used for training of neural network (NN) is created using HSPICE. Performance parameters considered are delay and power dissipation. The several analyses are performed at 32nm technology.
基于前瞻性神经网络设计的片上互连系统性能评估
由于技术在深亚微米区域的规模化,片上互连已成为影响整体电路性能的主要问题。因此,有必要对互连的性能进行评估,以预测设计的输出。本文将反向传播前馈神经网络(FFNN)技术应用于驱动-互连-负载(DIL)模型的性能预测。采用Levenberg-Marquardt (LM)算法作为训练算法。与传统的性能分析方法相比,神经网络模型的预测速度更快。此外,所提出的方法与仿真方法密切相关,从而描述了所开发模型的准确性。用于神经网络训练的数据集是使用HSPICE创建的。性能参数考虑延迟和功耗。这几项分析都是在32nm技术下进行的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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