Silicon epitaxy by low-temperature RF-PECVD using SiF4/H2/Ar gas mixtures for emitter formation in crystalline solar cells

Ronan Léal, J. Dornstetter, F. Haddad, G. Poulain, J. Maurice, P. Cabarrocas
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引用次数: 3

Abstract

This paper describes ongoing studies on the emitter formation by PECVD (Plasma Enhanced Chemical Vapor Deposition) using SiF4/H2/Ar chemistry in crystalline silicon solar cells. H2 depletion and ion bombardment have been highlighted to be crucial factors to sustain epitaxial growth. By controlling these parameters we have been able to produce a 2.5μm-thick high-quality silicon epitaxy and to define a process window. Structural properties were assessed by in-situ and exsitu spectroscopic ellipsometry as well by HR-TEM (High Resolution Transmission Electron Microscopy) images with the diffraction patterns. These studies have been extended to n-type and p-type doped layers.
利用si4 /H2/Ar气体混合物低温RF-PECVD在晶体太阳能电池中形成发射极
本文介绍了基于si4 /H2/Ar的等离子体增强化学气相沉积(PECVD)技术在晶体硅太阳能电池中形成发射极的研究进展。H2耗尽和离子轰击是维持外延生长的关键因素。通过控制这些参数,我们能够生产出2.5μm厚的高质量硅外延,并定义了一个工艺窗口。通过原位和原位椭偏光谱以及高分辨率透射电子显微镜(HR-TEM)衍射图对其结构性能进行了评价。这些研究已经扩展到n型和p型掺杂层。
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