A 1.5 Ghz-band Saw Filter Using Flip-chip-bonding Technique

Abstract

We applied a stud-bump-bonding (SBB) technique which is a kind of flip-chip-bonding (FCB) technique to a l.5GHz-band surface acoustic wave (SAW) filter. The SAW filter mounted by the SBB technique showed almost the same frequency characteristics as that mounted by a conventional wire-bonding technique at 1.5GHz. Using the SBB technique, the area of the SAW filter became 115 comparing with conventional SAW filters mounted by the wire-bonding technique and the weight became less than 1/10 by the share of the package. The SBB technique has; a lot of potential to reduce the size and weight and to realize small and high performance modules even above GHz frequencies.