Wafer-level vacuum-packaged two-axis MEMS scanning mirror for pico-projector application

Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components Pub Date : 2014-03-07 DOI:10.1117/12.2038249

U. Hofmann, F. Senger, J. Janes, C. Mallas, V. Stenchly, T. von Wantoch, H. Quenzer, M. Weiss

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引用次数: 18

Abstract

Hermetic wafer level packaging of optical MEMS scanning mirrors is essential for mass-market applications. It is the key to enable reliable low-cost mass producible scanning solutions. Vacuum packaging of resonant MEMS scanning mirrors widens the parameter range specifically with respect to scan angle and scan frequency. It also allows extending the utilizable range of mirror aperture size based on the fact that the energy of the high-Q oscillator can be effectively conserved and accumulated. But there are also some drawbacks associated with vacuum packaging. This paper discusses the different advantageous and disadvantageous aspects of vacuum packaging of MEMS scanning mirrors with respect to laser projection displays. Improved MEMS scanning mirror designs are being presented which focus on overcoming previous limitations. Finally an outlook is presented on the suitability of this technology for very large aperture scanning mirrors to be used in high power laser applications.

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用于微型投影仪的晶圆级真空封装双轴MEMS扫描镜

光学MEMS扫描镜的密封晶圆级封装对于大众市场应用至关重要。这是实现可靠、低成本、大批量生产的扫描解决方案的关键。谐振式MEMS扫描镜的真空封装特别拓宽了扫描角度和扫描频率的参数范围。由于高q振荡器的能量可以有效地守恒和积累，因此可以扩大反射镜孔径尺寸的利用范围。但是真空包装也有一些缺点。本文针对激光投影显示器，讨论了MEMS扫描镜真空封装的不同优缺点。改进的微机电系统扫描镜设计的重点是克服以往的局限性。最后展望了该技术在大功率激光大孔径扫描镜应用中的适用性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components

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